Diffusion bonded sputter target assembly and method of making
AssigneeTosoh SMD, Inc.
InventorHao Zhang
Life of this patent
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Abstract
A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the target, interlayer and backing plate together. Preferably, the titanium interlayer is provided as a foil, but may also be formed on a mating surface of either the target or the backing plate by electroplating, sputtering, electroless plating, or plasma spraying. The target may be advantageously machined with grooves defining salient points prior to providing the interlayer.
Claims10
A sputter target assembly comprising:
- a target comprising cobalt,
- a backing plate comprising aluminum or copper, and
- an interlayer comprising titanium between said target and said backing plate
- wherein said target, said interlayer, and said backing plate are diffusion bonded together.
A method of forming a sputter target assembly comprising the steps of:
- providing a target comprising cobalt and a first mating surface;
- providing a backing plate comprising aluminum or copper and a second mating surface;
- providing an interlayer comprising titanium;
- and
- pressing said first mating surface together with said second mating surface with said interlayer therebetween to bond said target to said backing plate.
Dependencies are inferred from the claim text.