Method for making elastic bumps from a wafer mold having grooves

Abstract

This invention relates to a manufacturing process for making elastic bumps in the micro-electronic field. It solves the problem to mould micrometer sized elastic features by means of a micro-machined mould. The method is a reproducible moulding technology to achieve elastic bumps being a perfect replication of the mould. The mould is made of one or several grooves etched in a silicon wafer. The method includes the steps of: cleaning the surface of the mould (100) from dust and other particles; depositing a release agent on the mould and the release agent, e.g. Parylene or silane, forming a conformal self-assembled layer (118) on the surface of the mould; putting on a curable elastomer, to form an elastomeric structure (208) on the mould; curing the mould and the structure; and separating the structure from the mould.

Dependencies are inferred from the claim text.