Growth of very uniform silicon carbide epitaxial layers
AssigneeCree, Inc.
InventorsKenneth George Irvine, Michael James Paisley, Olle Claes Erik Kordina
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AssigneeCree, Inc.
InventorsKenneth George Irvine, Michael James Paisley, Olle Claes Erik Kordina
Estimating the term…
An improved chemical vapor deposition method is disclosed that increases the uniformity of silicon carbide epitaxial layers and that is particularly useful for obtaining thicker epitaxial layers. The method comprises heating a reactor to a temperature at which silicon carbide source gases will form an epitaxial layer of silicon carbide on a substrate in the reactor; and then directing a flow of source and carrier gases through the heated reactor to form an epitaxial layer of silicon carbide on the substrate with the carrier gases comprising a blend of hydrogen and a second gas in which the second gas has a thermal conductivity that is less than the thermal conductivity of hydrogen so that the source gases deplete less as they pass through the reactor than they would if hydrogen is used as the sole carrier gas.
A method of forming epitaxial layers of silicon carbide on an appropriate substrate by chemical vapor deposition, the method comprising:
In a method of forming epitaxial layers of silicon carbide on appropriate substrates by chemical vapor deposition, and in which silane and propane source gases are blended with hydrogen as the carrier gas and directed into a reactor that is heated to a temperature of between about 1500 and 1650.degree. C. at which the silane and propane will react to form an epitaxial layer of silicon carbide on a substrate, the improvement comprising:
In a method of forming epitaxial layers of silicon carbide on a plurality of appropriate substrates by chemical vapor deposition by:
Dependencies are inferred from the claim text.