Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate

An electronic package assembly for containing and providing electrical contacts to a semiconductor device comprising:

• a substrate including a chip placement area designated for disposing said semiconductor device, said substrate further including a first surface having a plurality of mutually insulated metallic contact segments as a ring-shape surrounding said chip area provided as ground and power contact pads for said semiconductor device wherein said mutually insulated contact segments having a gap of approximately 0.05 to 0.3 millimeters between each of said segments;
• a plurality of mutually insulated split planes, provided as ground and power split planes on a second surface of said substrate for said semiconductor device wherein said mutually insulated split planes having a gap between every two adjacent split planes;
• said chip area comprising a cutoff cavity for placing said semiconductor device therein, said cutoff cavity including a plurality of cutoff edges on perimeters of said cutoff cavity extending from said first surface to said second surface;
• a plurality of next level contact means disposed on said first surface for providing next level contacts;
• a plurality of connection means for electrically connecting each of said ground and power contact pads on said first surface to a corresponding mutually insulated ground and power contact pads on said first surface;
• said plurality of connection means further includes a plurality of split conductive strips wrapping around cutoff edges for connecting said power and ground contact pads on said first surface to said ground and power split planes on said second surface;
• a plurality of signal contact pads provided as signal contacts for said semiconductor device, disposed on said first surface away from said mutually insulated contact segments opposite said chip area;
• a plurality of metal traces disposed on said first surface each connected to said signal contact pads extending away from said mutually insulated contact segments for electrically connecting to said next level contact means;
• a plurality of second surface coplanar traces each connected to one of said signal contact pads disposed on said first surface through a via connection penetrating said substrate;
• said mutually insulated split planes disposed on said second surface having a gap between two adjacent split planes and each of said second surface coplanar traces disposed in one of said gaps;
• a plurality of split plane via connection means penetrating from said first surface to said second surface through said substrate for connecting each of said split planes on said second surface to one of said next level connection means on said first surface;
• a plurality of coplanar trace via connection means penetrating from said first surface to said second surface through said substrate for connecting each of said second surface coplanar traces to one of said next level connection means on said first surface;
• and
• an electrically conductive heat spreader overlaying and attached to said second surface of said substrate via an adhesive layer wherein said heat spreader having sharp edged connectors sticking out of said heat spreader and penetrating said adhesive layer wherein said sharp-edged connectors are prearranged for contacting said ground split planes on said second surface of said substrate for providing a ground potential for said semiconductor device and for conducting a heat generated by said semiconductor device to said heat spread therethrough.