Face on face flip chip integration

A method for creating an integrated circuit device comprising:

• creating an integrated circuit assembly by
• providing a memory circuit die made with a memory circuit fabrication process, said memory circuit die having a first plurality of conductive contacts arranged on a first connecting side of said memory circuit die, and a memory circuit formed on said memory circuit die and electrically coupled to said first plurality of conductive contacts;
• providing a logic circuit die made with a logic circuit fabrication process, said logic circuit die having a second plurality of conductive contacts arranged on a second connecting side of said logic circuit die, and a logic circuit formed on said logic circuit die and electrically coupled to said second plurality of connecting contacts;
• and
• attaching said memory circuit die and said logic circuit die together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said memory circuit and said logic circuit, thereby forming a unitary, integrated circuit assembly.

An integrate circuit assembly comprising:

• a first circuit die made with a first circuit fabrication process, said first circuit die having a first plurality of conductive contacts arranged on a first connecting side of said first circuit die;
• a second circuit die made with a second circuit fabrication process, said first circuit die and said second circuit die being attached together, said second circuit die having a second plurality of conductive contacts arranged on a second connecting side of said second circuit die;
• and
• wherein said first circuit die and said second circuit die are attached together in a flip-chip fashion with said first connecting side in close proximity to said second connecting side and with said first plurality of conductive contacts connected to said second plurality of contacts to provide electrical connections between said first circuit die and said second circuit die, thereby forming a unitary, integrated circuit assembly.