Method of making an electronic component using reworkable underfill encapsulants
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsBodan Ma, Quinn K. Tong, Chaodong Xiao
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Abstract
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.
Claims32
A method for making an electronic assembly, the electronic assembly comprising an electronic component connected to a substrate, and a cured reworkable thermoplastic composition disposed between the electronic component and the substrate, the method comprising;
- (a) providing a curable composition comprising
- (i) one or more mono-functional maleimide compounds, or a combination of mono-function maleimide compounds and mono-functional vinyl compounds;
- (ii) a curing initiator selected from the group consisting of a free-radical initiator, a photoinitiator, and a combination of those;
- (b) disposing the curable composition between the electronic component and the substrate;
- and
- (c) curing the curable composition in situ.
Dependencies are inferred from the claim text.