Semiconductor device having SEPP connected NPN and PNP transistors
AssigneesKabushiki Kaisha Kenwood, Sanken Denki Kabushiki Kaisha
InventorsTatsuhiko Okuma, Akira Miyamoto, Hachiro Sato
Life of this patent
Estimating the term…
Loading patent…
AssigneesKabushiki Kaisha Kenwood, Sanken Denki Kabushiki Kaisha
InventorsTatsuhiko Okuma, Akira Miyamoto, Hachiro Sato
Estimating the term…
A semiconductor device capable of maintaining good temperature compensation and reducing manufacture costs of SEPP connecting NPN and PNP power transistors and temperature compensating and biasing circuits. A first semiconductor device has an ordinary bias diode formed on the same semiconductor substrate as an NPN power transistor. A second semiconductor device has one or a plurality of Schottky barrier type diodes formed on the same semiconductor substrate as a PNP power transistor. The forward voltage drop V.sub.1 of the diode is set to an arbitrary constant value smaller than E exclusive of about E/2, and the total forward voltage drop V.sub.2 of the Schottky barrier diode or diodes is set to a predetermined value of about (E-V.sub.1), where E is a total forward voltage drop between the bases and emitters of the NPN and PNP power transistors.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.