US 6,054,869 AGranted

Bi-level test fixture for testing printed circuit boards

AssigneeH+W Test Products, Inc.

InventorsGordon R. Hutton, Gerald Greene

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Abstract

A bi-level test fixture for testing printed circuit boards is provided. A series of guide pins emanate downwardly from the diaphragm board through corresponding guide pin apertures present through the probe plate. Upon application of a full vacuum to the test fixture, the diaphragm board is drawn completely toward the probe plate thus extending the guide pins through their corresponding guide pin apertures. The portion of the guide pins below the probe plate engage with a pneumatically actuated fork member. Upon release of the vacuum to the test fixture, the upward travel of the diaphragm board is limited and at a distance so that only functional test probes are in contact with the unit under test. Application of a full vacuum again enables disengagement of the fork member with the guide pin to allow the diaphragm board to travel fully upward to its resting position for removal of the unit under test. In-circuit testing may be conducted at either or both times when a full vacuum is applied to the test fixture resulting in both the functional test probes and in-circuit test probes contacting the unit under test. A transition from functional testing to in-circuit testing, or vice versa, is accomplished without disengaging the functional test probes from the unit under test.

Claims10

Dependent claims

A bi-level automatic testing equipment test fixture for a printed circuit board, comprising:

a probe plate, having an upper surface, defining at least one functional test probe aperture and at least one in-circuit test probe aperture therein;
said probe plate further defining at least one guide pin aperture therethrough;
at least one functional test probe residing in said at least one functional test probe aperture and extending upwardly from said upper surface of said probe plate a first distance and at least one in-circuit test probe residing in said at least one in-circuit test probe aperture and extending upwardly from said upper surface of said probe plate a second distance;
said first distance being greater than said second distance;
a diaphragm board, having a lower surface, positioned above said probe plate defining an air chamber therebetween;
seal means positioned between said probe plate and said diaphragm board for maintaining a vacuum between said probe plate and said diaphragm board upon removal of air present in said air chamber;
said diaphragm board being movable relative to said probe plate;
at least one guide pin connected to and emanating downwardly from said diaphragm board;
said at least one guide pin being co-axial with said at least one guide pin aperture;
said at least one guide pin including a free end not connected to said diaphragm board;
vacuum means for moving said diaphragm board proximal to said probe plate and causing said at least one guide pin to protrude through said at least one guide pin aperture with said free end residing below said probe plate with both said at least one functional test probe and said at least one in-circuit test probe being in contact with a printed circuit board residing on said diaphragm board representing an in-circuit test condition;
means for engaging said free end of said at least one guide pin and securing said diaphragm board relative to said probe plate;
with said vacuum means removed, said diaphragm board being secured at a distance from said probe plate whereby only said at least one functional test probe is in contact with said printed circuit board representing a functional test condition.

10 more elements

A method for conducting automatic functional and in-circuit testing of a printed circuit board, comprising the steps of:

providing a probe plate, having an upper surface, defining a plurality of functional test probe apertures and a plurality of in-circuit test probe apertures therein;
said probe plate further defining a plurality of guide pin apertures therethrough;
providing a plurality of functional test probes respectively residing in said plurality of functional test probe apertures and extending upwardly from said upper surface of said probe plate;
providing a plurality of in-circuit test probes respectively residing in said plurality of in-circuit test probe apertures and extending upwardly from said upper surface of said probe plate;
said plurality of functional test probes extending a greater distance above said probe plate than said plurality of in-circuit test probes;
providing a diaphragm board, having a lower surface, positioned above said probe plate defining an air chamber therebetween;
providing a seal positioned between said probe plate and said diaphragm board for making said air chamber substantially air-tight;
providing a plurality of guide pins connected to and emanating downwardingly from said diaphragm board;
said plurality of guide pins corresponding to and being co-axial with a corresponding one of said plurality of guide pin apertures;
each of said plurality of guide pins include a free end not connected to said diaphragm board;
removing air from said air chamber between said probe plate and said diaphragm board creating a vacuum therebetween;
moving said diaphragm board proximal said probe plate;
injecting said plurality of guide pins through respective corresponding guide pin apertures with free ends of said plurality of guide pins being positioned below said probe plate;
applying a full vacuum between said probe plate and said diaphragm board;
positioning said diaphragm board sufficiently close to said probe plate for said plurality of said functional test probes and said plurality of in-circuit test probes to contact a printed circuit board being carried by said diaphragm board;
engaging said free ends of said plurality of guide pins limiting upward travel of said diaphragm board;
removing said vacuum between said probe plate and said diaphragm board;
positioning said diaphragm board above said probe plate with only said plurality of functional test probes being in contact with said printed circuit board;
applying a full vacuum between said probe plate and said diaphragm board;
positioning said diaphragm board sufficiently close to said probe plate for said plurality of said functional test probes and said plurality of in-circuit test probes to contact said printed circuit board being carried by said diaphragm board;
disengaging said free ends of said plurality of guide pins allowing unrestricted upward travel of said diaphragm board;
and
removing said vacuum between said probe plate and said diaphragm board.

20 more elements

Dependencies are inferred from the claim text.