Method and system for reducing water vapor in integrated circuit packages prior to reflow

A system for removing trapped moisture from component packages and thereafter assembling the components onto a circuit board, comprising:

• a thermal chamber which receives therein at least one parts tape and reel containing a plurality of components and which heats said plurality of components at a predetermined temperature for a predetermined period of time;
• an outfeed slot located on a wall of the thermal chamber and configured such that a leading portion of the at least one parts tape passes therethrough;
• a slot cover, coupled to the outfeed slot, for substantially covering the outfeed slot so as to inhibit outflow of heat from the thermal chamber while allowing the parts tape to pass through the outfeed slot;
• and
• a pick and place machine, located adjacent to said thermal chamber, which retrieves components from portions of the parts tape that have passed through the outfeed slot and places the retrieved components onto designated circuit boards.

A system for assembling components onto a circuit board, comprising:

• means for heating at least one parts tape and reel and at least one component contained within the at least one parts tape at a predetermined temperature for a predetermined period of time in a thermal chamber;
• means for passing a portion of the at least one parts tape from within the thermal chamber, at the expiration of the predetermined length of time;
• and
• means for retrieving the at least one component from the portion of the parts tape which has passed out of the thermal chamber and placing the at least one component onto a designated circuit board.

A system for assembling components onto a circuit board, comprising:

• means for heating at least one component at a predetermined temperature within a thermal oven for a predetermined period of time;
• means for passing the at least one component out of the thermal oven at the expiration of the predetermined length of time, such that the at least one component emerges externally of the thermal oven;
• means for retrieving the at least one component which emerges from the thermal oven;
• and
• means for placing the at least one component onto a designated circuit board.

A method of assembling components onto a circuit board, comprising:

• placing at least one parts tape and reel, having at least one component therein, in an interior chamber of a thermal oven;
• heating the at least one parts tape and reel and the at least one component at a predetermined temperature within the thermal oven for a predetermined period of time;
• passing a portion of the at least one parts tape from the thermal oven, at the expiration of the predetermined length of time, through an outfeed slot on the thermal oven;
• and
• retrieving the at least one component from the portion of the parts tape which has passed through the outfeed slot and placing the at least one component onto a designated circuit board.

A method of assembling components onto a circuit board, comprising:

• placing at least one component into an interior chamber of a thermal oven;
• heating the at least one component at a predetermined temperature within the thermal oven for a predetermined period of time;
• passing the at least one component through an outfeed slot located on the thermal oven, at the expiration of the predetermined length of time, such that the at least one component emerges externally of the thermal oven;
• retrieving the at least one component which emerges from the thermal oven through the outfeed slot;
• and
• placing the at least one component onto a designated circuit board.

A thermally conditioned component, conditioned using the method comprising:

• placing at least one parts tape and reel in an interior chamber of a thermal oven, wherein the parts tape at least partially contains at least one component to be thermally conditioned;
• heating the at least one parts tape, reel, and said at least one component at a predetermined temperature within the thermal oven for a predetermined period of time;
• and
• at the expiration of a predetermined length of time, passing a portion of the at least one parts tape containing said at least one component from the thermal oven through an outfeed slot on the thermal oven.