Conformal thermal interface material for electronic components
AssigneeParker-Hannifin Corporation
InventorsMichael H. Bunyan, Miksa de Sorgo
Life of this patent
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Abstract
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
Claims19
A method of conductively cooling a heat-generating electronic component having an operating temperature range above normal room temperature and a first heat transfer surface disposable in thermal adjacency with a second heat transfer surface of a thermal dissipation member to define an interface therebetween, said method comprising the steps of:
- (a) providing a thermally-conductive material which is form-stable at normal room temperature in a first phase and conformable in a second phase to substantially fill said interface, said material having a transition temperature from said first phase to said second phase within the operating temperature range of said electronic component, and said material consisting essentially of at least one resin or wax component blended with at least one thermally-conductive filler;
- (b) forming said material into a self-supporting and free-standing film layer, said layer consisting essentially of said material and having a thickness of from about 1-10 mils;
- (c) applying said layer to one of said heat transfer surfaces;
- (d) disposing said heat transfer surfaces in thermal adjacency to define said interface;
- and
- (e) energizing said electronic component effective to heat said layer to a temperature which is above said phase transition temperature.
A thermally-conductive interface for interposition between a heat-generating electronic component having an operating temperature range above normal room temperature and a first heat transfer surface disposable in thermal adjacency with a second heat transfer surface of a thermal dissipation member, said interface comprising a self-supporting and free-standing film layer having a thickness of from about 1-10 mils and consisting essentially of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to said interface surfaces, said material having a transition temperature from said first phase to said second phase within the operating temperature range of said electronic component, and said material consisting essentially of at least one resin or wax component blended with at least one thermally-conductive filler.
A method of conductively cooling a heat-generating electronic component having an operating temperature range above normal room temperature and a first heat transfer surface disposable in thermal adjacency with a second heat transfer surface of a thermal dissipation member to define an interface therebetween, said method comprising the steps of:
- (a) providing a thermally-conductive material which is form-stable at normal room temperature in a first phase and conformable in a second phase to substantially fill said interface, said material having a transition temperature from said first phase to said second phase within the operating temperature range of said electronic component and comprising a blend of:
- (i) from about 25 to 50% by weight of an acrylic pressure sensitive adhesive component having a melting temperature of from about 90-100.degree. C.;
- (ii) from about 50 to 75% by weight of an .alpha.-olefinic, thermoplastic component having a melting temperature of from about 50-60.degree. C.;
- and
- (iii) from about 20 to 80% by weight of one or more thermally-conductive fillers;
- (b) forming said material into a self-supporting layer;
- (c) applying said layer to one of said heat transfer surfaces;
- (d) disposing said heat transfer surfaces in thermal adjacency to define said interface;
- and
- (e) energizing said electronic component effective to heat said layer to a temperature which is above said phase transition temperature.
A thermally-conductive interface for interposition between a heat-generating electronic component having an operating temperature range above normal room temperature and a first heat transfer surface disposable in thermal adjacency with a second heat transfer surface of a thermal dissipation member, said interface comprising a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to said interface surfaces, said material having a transition temperature from said first phase to said second phase within the operating temperature range of said electronic component, and comprising a blend of:
- (a) from about 25 to 50% by weight of an acrylic pressure sensitive adhesive component having a melting temperature of from about 90-100.degree. C.;
- (b) from about 50 to 75% by weight of an .alpha.-olefinic, thermoplastic component having a melting temperature of from about 50-60.degree. C.;
- and
- (c) from about 20 to 80% by weight of one or more thermally-conductive fillers.
Dependencies are inferred from the claim text.