Combination electromagnetic shield and heat spreader
AssigneeDell USA, L.P.
InventorsCharles D. Hood, III, Damon W. Broder, Eric B. Holloway
Life of this patent
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Abstract
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, such as a CPU, in a computer system includes a first surface thermally coupling the apparatus to an integrated circuit (IC). The apparatus, including the first surface, is of a material, such as some alloys of beryllium copper, with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin). The material is electrically conductive.
Claims30
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, the apparatus comprising:
- a first surface, the first surface thermally coupling the apparatus to an integrated circuit (IC);
- wherein the apparatus, including the first surface, is of a material with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin), the material being electrically conductive.
A computer system comprising:
- an integrated circuit (IC) having an outer surface;
- a mounting board having a voltage reference, the IC being mounted to the mounting board;
- an electromagnetic shield thermally coupled to the outer surface, the electromagnetic shield being of a material with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin), the material being electrically conductive;
- wherein the electromagnetic shield is positioned to provide electromagnetic shielding and heat dissipation for the IC.
A computer system comprising:
- a printed circuit board having a ground plane and a first planar side;
- a central processing unit mounted on the first planar side of the printed circuit board, the central processing unit having an outer surface;
- a memory electrically coupled to the central processing unit;
- an electromagnetic shield thermally coupled to the outer surface, the electromagnetic shield being of a material with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree(Kelvin), the material being electrically conductive, the electromagnetic shield secured to the printed circuit board, the electromagnetic shield having a generally planar portion extending over at least a majority of the first planar side of the printed circuit board including the central processing unit.
An apparatus for electrically coupling an electromagnetic shield to a voltage reference wherein:
- the apparatus is of a material with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin), the material being electrically conductive;
- and
- the apparatus is electrically connected to an electromagnetic shield and is electrically contacting a first surface electrically coupled to a voltage reference.
Dependencies are inferred from the claim text.