Stackable high density RAM modules

A stacked circuit assembly adapted for mounting memory modules in close proximity to an integrated circuit, said stacked circuit assembly comprising:

• an integrated circuit mounted for electrical connection on a mounting surface of a circuit board;
• at least two stacked circuit boards mounted in substantially parallel arrangement with respect to said circuit board on which said integrated circuit is mounted, wherein surfaces of said stacked circuit boards and a surface of said circuit board together define spaces therebetween;
• a memory module mounted for electrical connection on a surface of each of said stacked circuit boards;
• an interface connector mounted for electrical connection on said circuit board and an interface connector mounted for electrical connection on each of said stacked circuit boards, wherein said interface connector mounted on said circuit board mates with said interface connector on an adjacent one of said stacked circuit boards, and wherein said interface connector mounted on each of said stacked circuit boards mates with said interface connector on an adjacent one of said stacked circuit boards, thereby providing both mechanical and electrical interconnection between said boards, and wherein said interface connectors together extend across said spaces defined between said boards;
• said stacked circuit boards further comprising connection paths for communicating signals between said interface connectors and said memory modules, at least one of said connection paths being oriented to share signals between said stacked circuit boards, and at least one of said connection paths being oriented to dedicate a signal to a memory module on one of said stacked circuit boards and to prevent sharing of said dedicated signal between said stacked circuit boards;
• wherein said integrated circuit and said memory modules are mounted for electrical interconnection through said boards and said interface connectors, thereby reducing the physical distance between said integrated circuit and said memory modules.

A stacked circuit assembly adapted for mounting memory modules in close proximity to an application specific integrated circuit, said stacked circuit assembly comprising:

• an integrated circuit mounted for electrical connection on a mounting surface of a printed circuit board;
• at least two stacked printed circuit boards mounted in substantially parallel arrangement with respect to said printed circuit board on which said integrated circuit is mounted, said stacked printed circuit boards each having a surface facing toward a surface of an adjacent board, wherein said surfaces of said stacked printed circuit boards and a surface of said printed circuit board together define spaces therebetween, each of said stacked printed circuit boards further comprising circuit paths for communicating signals therethrough;
• at least one memory module mounted for electrical connection on a surface of each of said stacked printed circuit boards, each of said memory modules being connected to at least one of said circuit paths, at least one of said circuit paths being oriented to share signals between said stacked printed circuit boards, and at least one of said circuit paths being oriented to dedicate a signal to a memory module on one of said stacked printed circuit boards and to prevent sharing of said dedicated sisal between said stacked printed circuit boards;
• interface connectors mounted for electrical connection on said printed circuit board and interface connectors mounted for electrical connection on each of said stacked printed circuit boards, each of said interface connectors mounted on said stacked printed circuit boards being connected to at least one of said circuit paths, said interface connectors mounted on said printed circuit board being mated with said interface connectors mounted on a facing surface of an adjacent stacked printed circuit board and said interface connectors mounted on an opposite surface of said adjacent stacked printed circuit board being mated with said interface connectors mounted on another adjacent one of said stacked printed circuit boards, thereby providing both mechanical and electrical connection between said boards, wherein said interface connectors together extend across said spaces defined between said boards when mated;
• wherein said integrated circuit and said memory modules are mounted for electrical interconnection through said boards, said interface connectors and said circuit paths, thereby reducing the physical distance between said integrated circuit and said memory module.

A method for mounting memory modules in close proximity to an integrated circuit, said method comprising the steps of:

• (a) providing a circuit board, an integrated circuit mounted for electrical connection on a surface of said circuit board, and a connector mounted for electrical connection on said circuit board;
• (b) providing at least one stackable circuit board, a memory module mounted for electrical connection on a surface of said stackable circuit board, a first connector mounted for electrical connection on the facing surface of said stackable circuit board, and a second connector mounted for electrical connection on an opposite surface of said stackable circuit board;
• (c) positioning said stackable circuit board with a surface facing said circuit board and in substantially parallel arrangement with respect to said circuit board, thereby defining a space between said stackable circuit board and said circuit board;
• (d) mating said connector on said circuit board with said first connector on said stackable circuit board, thereby providing both mechanical and electrical interconnection between said boards, wherein said connectors together extend across the space defined between said boards;
• (e) positioning said second connector of said stacked circuit board for mating with a first connector of another stacked circuit board;
• and
• (f) providing electrical interconnection through said boards and said connectors, thereby reducing the physical distance between said integrated circuit and said memory module.