Low profile ovenized oscillator packing having a high thermal conductivity substrate
AssigneeCTS Corporation
InventorSteven J. Fry
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AssigneeCTS Corporation
InventorSteven J. Fry
Estimating the term…
A low profile integrated oscillator operable to provide an oscillator signal includes a substrate having a cavity and a via passing through the substrate. A crystal or other resonator is disposed in the cavity and stabilizes the oscillator signal. An electrical circuit means is mounted to the substrate and electrically connects to the via to condition the oscillator signal. A cover seals the resonator in the cavity. A connector electrically connects the resonator to the via. A heater is mounted to the substrate to elevate the oscillator temperature and a temperature sensor is mounted to the substrate to monitor and control the oscillator temperature. The substrate is surrounded by an insulation and mounted within a housing. The housing has a connection means for connecting to an external electrical circuit.
An ovenized oscillator operable to provide an oscillator signal, comprising:
An ovenized oscillator operable to provide an oscillator signal, comprising:
Dependencies are inferred from the claim text.