Thermally conductive composite material
AssigneeChip Coolers, Inc.
InventorKevin A. McCullough
Life of this patent
Estimating the term…
Abstract
A conductive molding composition, with a thermal conductivity above 22 W/m.degree. K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
Claims22
A high thermally conductive molding composition having a thermal conductivity above 22 W/m.degree. K. and being net-shade moldable, comprising:
- a polymer base matrix of, by volume, between 30 and 60 percent;
- a first thermally conductive filler, by volume, between 25 and 60 percent;
- said first thermally conductive filler having an aspect ratio of at least 10:1;
- and
- a second thermally conductive filler, by volume, between 10 and 25 percent;
- said second thermally conductive filler having an aspect ratio of less than 5:1.
A thermally conductive polymer composition, having a thermal conductivity over 22 W/m.degree. K. and being net-shape moldable, comprising a mixture of a polymer and a first thermally conductive filler material and a second thermally conductive filler material;
- said first thermally conductive filler material having an aspect ratio greater than 10:1;
- said second thermally conductive filler material having an aspect ratio less than 5:1.
A thermally conductive composition, having a thermal conductivity over 22 W/m.degree. K. and being net-shape moldable, comprising:
- a polymer base matrix material;
- a first thermally conductive filler material having an aspect ratio configuration of at least 10:1;
- and
- a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less.
A thermally conductive injection molding composition having a thermal conductivity above 22 W/m.degree. K. and being net-shape moldable, comprising:
- a metallic base matrix material;
- a first thermally conductive filler material having an aspect ratio configuration of at least 10:1;
- said first thermally conductive filler being carbon fiber;
- and
- a second thermally conductive filler material having an aspect ratio configuration of 5:1 or less;
- said second thermally conductive filler being made of a material selected from the group consisting of carbon and boron nitride.
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m.degree. K. and being net-shape moldable, comprising:
- a polymer base matrix of, by volume, between 30 and 60 percent;
- a first thermally conductive filler, by volume, between 25 and 60 percent;
- said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of approximately 800 W/m.degree. K.;
- and
- a second thermally conductive filler, by volume, between 10 and 25 percent;
- said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of approximately 400 W/m.degree. K.
A high thermally conductive injection molding composition having a thermal conductivity above 22 W/m.degree. K. and being net-shape moldable, comprising:
- a polymer base matrix of, by volume, between 30 and 60 percent;
- a first thermally conductive filler, by volume, between 25 and 60 percent;
- said first thermally conductive filler having an aspect ratio of at least 10:1 and a thermal conductivity of at least 800 W/m.degree. K.;
- and
- a second thermally conductive filler, by volume, between 10 and 25 percent;
- said second thermally conductive filler having an aspect ratio of less than 5:1 and a thermal conductivity of at least 400 W/m.degree. K.
Dependencies are inferred from the claim text.