Parallel HV MOSFET high power stable amplifier
AssigneeENI Technologies, Inc.
InventorsYogendra K. Chawla, Craig A. Covert
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AssigneeENI Technologies, Inc.
InventorsYogendra K. Chawla, Craig A. Covert
Estimating the term…
A high power grounded-drain source follower RF amplifier circuit employs a high voltage MOSFET. The RF signal at the input is applied with respect to ground via an isolation transformer whose secondary feeds the signal between gate and source. The output is taken from the source with respect to drain, which is grounded. A 13.56 MHz 3 KW power amplifier topology with isolated RF input drive for each MOSFET die uses a pair of kilowatt power transistors or KPTs, in which there are multiple large area MOSFET dies, with the drain regions of the dies being formed over a major portion of the die lower surface. The drain regions are in direct electrical and thermal contact with the conductive copper flange. The source and gate regions are formed on the dies away from the flat lower surface. One or more pairs of multi-chip KPTs can be configured to design stable 2.5 KW, 5 KW and 10 KW RF plasma generators at 13.56 MHz. The generators employ a low pass/high pass filter arrangement (diplexer) at the output for low harmonic distortion and dissipative harmonic termination. The terminated high pass filter reduces the gate-to-source differential RF voltage and protects the MOSFETS from damage.
A high power push-pull RF amplifier for amplifying RF power in a given frequency band, comprising an RF input terminal, an RF output terminal, a DC power source, first and second kilowatt power transistor devices, each said kilowatt power transistor device including a thermally and electrically conductive flange, a multi-chip array formed of a plurality of semiconductor dies, each said die having a flat lower surface with a drain formed over a majority of said lower surface, a source and a gate formed respectively on portions of the die away from said flat lower surface, and means for seating the drains of the dies in direct thermal and electrical contact with said flange so that said flange serves as drain terminal and as heat sink for said dies;
A high power grounded-drain source follower RF amplifier circuit which comprises an input terminal;
A high power push-pull RF amplifier for amplifying RF power in a given frequency band, comprising an RF input terminal, an RF output terminal, a power source, first and second kilowatt power transistor devices, each said kilowatt power transistor device including a thermally and electrically conductive flange, a multi-chip array formed of a four semiconductor dies, each said die having a flat lower surface with a drain formed over a majority of said lower surface, a source and a gate formed respectively on portions of the die away from said flat lower surface, and means for seating the drains of the dies in direct thermal and electrical contact with said flange so that said flange serves as drain terminal and as heat sink for said dies;
Dependencies are inferred from the claim text.