Multilayer microelectronic circuit

A multilayer microelectronic circuit to be directly mounted on a substrate, comprising:

• a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, said dielectric layers and said patterned electrodes forming an electrical circuit, said laminated structure having side surfaces extending along a direction in which said dielectric layers and said patterned electrodes are laminated;
• an input line formed at one of said side surfaces and connected with an input section of said electrical circuit;
• an output line formed at one of said side surfaces and connected with an output section of said electrical circuit;
• a grounding line formed at one of said side surfaces and connected with a grounding section of said electrical circuit;
• and
• a signal line formed at one of said side surfaces, for connecting sections of said electrical circuit, said signal line having an end positioned adjacent a mounting surface at which said multilayer microelectronic circuit is directly mounted on the substrate, the end of said signal line being separate from said mounting surface so as to be insulated from electrical contact with the substrate.

A multilayer microelectronic circuit to be directly mounted on a substrate, comprising:

• a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, said dielectric layers and said patterned electrodes forming an electrical circuit, said laminated structure having side surfaces extending along a direction in which said dielectric layers and said patterned electrodes are laminated, said dielectric layers including a lower-most dielectric layer which has a mounting surface at which said multilayer microelectronic circuit is directly mounted on the substrate, said dielectric layers other than said lower-most dielectric layer being formed respectively with grooves which form a channel at one of the side surfaces, said lower-most dielectric layer being free of said groove;
• an input line formed at one of said side surfaces and connected with an input section of said electrical circuit;
• an output line formed at one of said side surfaces and connected with an output section of said electrical circuit;
• a grounding line formed at one of said side surfaces and connected with a grounding section of said electrical circuit;
• and
• a signal line formed at the surface of said channel, for connecting sections of said electrical circuit, said signal line having an end positioned adjacent said mounting surface, the end of said signal line being separate from said mounting surface so as to be insulated from electrical contact with the substrate.