Method of manufacturing an enclosed transceiver
AssigneeMicron Communications, Inc.
InventorsMark E. Tuttle, John R. Tuttle, Rickie C. Lake
Life of this patent
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Abstract
The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification ("RFID") tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.
Claims14
A radio frequency transceiver, comprising:
- first and second covers, each cover being composed of at least a first layer and a second layer, the first layer being a sheet of polymer film, and the second layer being a barrier material which is a barrier to water vapor;
- and
- a radio frequency transceiver circuit mounted between the two covers;
- wherein the two covers are sealed together along a peripheral contour which completely encircles the transceiver.
A method of manufacturing a radio frequency transceiver, comprising the steps of:
- providing two covers, each cover being composed of a sheet of polymer film;
- forming on each of the two covers a barrier material which is a barrier to water vapor;
- mounting a transceiver circuit between the two covers;
- and
- sealing the two covers together along a peripheral contour which completely encircles the transceiver.
Dependencies are inferred from the claim text.