Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Allan Gleason, William L. Guthrie
Life of this patent
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Abstract
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
Claims20
A polishing pad for a chemical mechanical polishing apparatus, comprising:
- an article having a polishing surface;
- an aperture formed in the article;
- and
- a substantially transparent plug including a first section with a first dimension and a second section with a second, different dimension;
- wherein the plug is secured in the aperture with the first section of the plug positioned in a first portion of the aperture and the second section of the plug positioned in a second portion of the aperture.
A polishing pad for a chemical mechanical polishing apparatus, comprising:
- an article having a polishing surface;
- an aperture formed in the article, the aperture including a first portion with a first dimension and a second portion with a second, different dimension;
- and
- a substantially transparent plug secured in the aperture.
A polishing pad for a chemical mechanical polishing apparatus, comprising:
- an article having a polishing surface;
- an aperture formed in the article;
- and
- a substantially transparent plug secured in the aperture, wherein the plug includes a first section with a first dimension and a second section with a second, different dimension, and a top surface of the plug is substantially coplanar with the polishing surface.
A polishing pad for a chemical mechanical polishing apparatus, comprising:
- a first layer having a polishing surface;
- a second layer adjacent to the first layer;
- an aperture through the first and second layers, the aperture including a first opening in the first layer with a first cross-sectional area and a second opening in the second layer with a second, smaller cross-sectional area;
- a substantially transparent plug positioned in the aperture;
- and
- an adhesive material fixing the plug in the aperture.
Dependencies are inferred from the claim text.