Microfabricated filter with specially constructed channel walls, and containment well and capsule constructed with such filters

A method for forming a microfabricated filter, comprising the steps of:

• providing a bulk substrate;
• forming an etch-stop layer within a first surface of said bulk substrate;
• forming openings in said etch-stop layer using a first predetermined etching process, said openings extending through said etch-stop layer into said bulk substrate;
• forming a sacrificial layer over at least part of said etch-stop layer;
• forming a thin film layer over at least part of said etch-stop layer and said sacrificial layer;
• forming openings through said thin film layer using said first predetermined etching process, wherein said openings through said thin film layer expose a portion of said sacrificial layer and are positioned relative to said openings in said bulk substrate such that said openings in said bulk substrate are at least partially blocked by said thin film structure and said openings through said thin film structure are at least partially blocked by said bulk substrate, and wherein said first predetermined etching process does not etch said bulk substrate, said etch-stop layer, said sacrificial layer, or said thin film layer;
• etching a second surface of said bulk substrate opposite said first surface of said bulk substrate through to said etch-stop layer using a second predetermined etching process, wherein said etching forms openings through said bulk substrate and said second predetermined etching process does not etch said etch-stop layer, said sacrificial layer or said thin film layer;
• and
• removing said sacrificial layer using a third predetermined etching process, wherein said third predetermined etching process does not etch said bulk substrate, said etch-stop layer or said thin film layer.

A microfabricated containment well, comprising:

• a one-piece side wall structure comprising a bulk substrate, said side wall structure having an open end;
• an end face connected to said side wall structure opposite said open end, said end face comprising a microfabricated filter;
• and
• a cavity bounded by said side wall structure and said end face.

A microfabricated containment capsule, comprising:

• a side wall structure comprising a one-piece bulk substrate;
• at least one end face connected to said side wall structure, said end face comprising a microfabricated filter;
• and
• a cavity bounded by said side wall structure and said at least one end face.

A method for forming a microfabricated containment capsule, comprising the steps of:

• forming a microfabricated containment well, said containment well having an open-faced cavity;
• placing a substance into said cavity of said containment well;
• providing a substrate;
• and
• hermetically sealing a face of said substrate to said open end of said containment well.

A method for forming a microfabricated containment capsule, comprising the steps of:

• forming a first microfabricated containment well and a second microfabricated containment well, each said containment well having an open-faced cavity;
• placing a substance into said cavity of said first containment well;
• and
• hermetically sealing said open end of said first containment well to said open end of said second containment well.

A method for forming a microfabricated containment capsule, comprising the steps of:

• forming a first and a second microfabricated containment well, each said containment well having a cavity and an open end, each said containment well formed by the steps of:
• providing a bulk substrate having a first surface;
• forming openings in said first surface of said bulk substrate;
• forming a sacrificial layer over at least part of said first surface of said bulk substrate;
• forming a thin film layer over said first surface of said bulk substrate and said sacrificial layer;
• forming openings through said thin film layer, wherein said openings through said thin film layer expose a portion of said sacrificial layer and are positioned relative to said openings in said bulk substrate such that said openings in said bulk substrate are at least partially blocked by said thin film structure and said openings through said thin film structure are at least partially blocked by said bulk substrate;
• etching an area of a second surface of said bulk substrate opposite said first surface of said bulk substrate through to said openings in said first surface of said bulk substrate, wherein said etching forms openings through said bulk substrate;
• and
• removing said sacrificial layer;
• placing a substance into said cavity of said first containment well;
• and
• hermetically sealing said open end of said first containment well to said open end of said second containment well.