Mounting assembly of integrated circuit device and method for production thereof
AssigneeNEC Corporation
InventorHirokazu Miyazaki
Life of this patent
Estimating the term…
Abstract
A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.
Claims15
A mounting assembly comprising:
- an integrated circuit device having a plurality of input/output terminals on one side thereof;
- a substrate for mounting said integrated circuit device;
- a plurality of through-holes provided in said substrate at positions corresponding to said plurality of input/output terminals of said integrated circuit device;
- a plurality of connecting members connecting said integrated circuit device to said substrate, wherein each of said plurality of connecting members extends from a respective one of said plurality of input/output terminals directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, and wherein each of said plurality of connecting members is electrically conductive;
- and
- a plurality of electrodes, wherein each of said plurality of electrodes is provided in a respective one of said plurality of through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members, wherein an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said outer circumferential surface of each of said plurality of electrodes.
A mounting assembly comprising:
- an integrated circuit device having a plurality of input/output terminals on a side;
- a substrate for mounting said integrated circuit device;
- a plurality of through-holes provided in said substrate at positions opposite a respective one of said plurality of input/output terminals of said integrated circuit device, said through-holes extending from a proximal side of said substrate adjacent to said respective one of said plurality of input/output terminals of said integrated circuit device to a distal substrate side located opposite to said proximal side of said substrate;
- a plurality of connecting members extending from a respective one of said input/output terminals of said integrated circuit device directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, wherein each of said plurality of connecting members is electrically conductive;
- and
- a plurality of electrodes, wherein each of said plurality of electrodes covers an inside surface of a respective one of said through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members and an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said electrode at said outer circumferential surface of said electrode.
Dependencies are inferred from the claim text.