Method for fabricating an electronics board with thermal-conduction cooling
AssigneeThomson-CSF
InventorsVito Suppa, Noel Begnis, Jean-Claude Aldon
Life of this patent
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Abstract
Method for fabricating thermally cooled electronic cards. A card of any kind is covered with a rigid heat sink shaped to fit the card and is attached thereto. The heat sink is formed in such a way that it fits as closely as possible the shape of the printed circuit. The printed circuit has components on one or both faces so that it is possible to increase the surface thermal coupling between the sink and the board. An optical sensor using a laser beam may be used.
Claims20
A method for fabricating an electronics board with thermal-conduction cooling, the board having at least one surface having a printed circuit including associated electronic components fixed to the printed circuit, the method comprising:
- scanning the at least one surface including the printed circuit with the fixed electronic components with a sensor to obtain profile information and related coordinates of various points on the at least one surface having the printed circuit including associated electronic components;
- delivering the profile information and related coordinates to a computer system;
- processing the profile information and related coordinates using an image program with a subroutine for smoothing the profile information and related coordinates so as to obtain smooth reliefs as a part of a machining program;
- controlling a programmable machine tool using the machining program to machine a rigid heat sink so that a machined face of the rigid heat sink closely matches the profile of the at least one surface having the printed circuit with the fixed electronic components;
- and
- covering and mechanically fixing the machined rigid heat sink to the at least one surface having the printed circuit with the fixed electronic components.
Dependencies are inferred from the claim text.