Lead frame design for increased chip pinout

In an integrated circuit (IC) package for accommodating an IC chip, wherein said IC chip includes a plurality of I/O pads for signal communications and a portion of said plurality of said I/O pads require a common signal, a method comprising the steps of:

• providing a lead frame having (a) a die attach platform;
• and (b) a plurality of leads, each lead having a circular portion formed as an attachment pad;
• providing a substrate having first and second surfaces on opposite sides of said substrate to provide rigid support to said lead frame, said substrate having vias of non-circular cross sections to allow electrical connections between said first and second surfaces;
• attaching said lead frame to said first surface of said substrate;
• attaching said IC chip to said die attach platform;
• electrically connecting said said I/O pads to said bus bar and said attachment pads;
• providing a solder mask on said second surface of said substrate, said solder masks having openings corresponding to said vias;
• and
• attaching solder balls to said solder mask and providing a flow of solder into said opening and said vias, said solder reaching said attachment pads so that an electrical connection is made between each solder ball and an I/O pad of said I/C chip.