Method of manufacturing a female electrical connector in a single layer flexible polymeric dielectric film substrate

A method of making in a flexible circuit a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches, comprising the steps of:

• directing a laser beam towards the flexible polymeric dielectric film substrate, cutting a smooth pattern through the flexible polymeric dielectric film substrate to define a passage extending through the flexible polymeric dielectric film substrate, and providing at least one resilient foldable flap normally closing the passage through the flexible polymeric dielectric film substrate;
• coating an electrically conductive material on the flexible polymeric dielectric film substrate including a circuit trace providing an electrical contact land area surrounding the pattern extending over the foldable flap to thereby form the female connector;
• and,
• inserting the male connector into the female connector through the flexible polymeric dielectric film substrate at the pattern, and deflecting the foldable flap and conductive coating into wiping electrical and mechanical engagement with the male connector to secure the male connector to the substrate in electrical contact with the trace circuit.