Smart sensor module
AssigneeTelemonitor, Inc.
InventorGeorge R. Ritmiller, III
Life of this patent
Estimating the term…
Loading patent…
AssigneeTelemonitor, Inc.
InventorGeorge R. Ritmiller, III
Estimating the term…
A smart sensor module includes a microcontroller and a signal conditioning integrated circuit. In a preferred embodiment, the signal conditioning integrated circuit is a mixed signal application specific integrated circuit (ASIC) incorporating an instrumentation amplifier, offset correction, sensitivity correction, low pass filtering, an analog-to-digital converter (ADC), a temperature sensor, digital I/O interface, a crystal oscillator circuit, and power on reset open collector output. The ADC can be multiplexed to the transducer, the temperature sensor or an external input. All features of the ASIC can be dynamically reconfigured at any time by the microcontroller. Offset correction is implemented with a 4-bit coarse adjustment digital-to-analog converter (DAC) and a 7-bit fine adjustment DAC to control the instrumentation amplifier reference voltage. The coarse adjustment allows compensation of sensor-to-sensor offset variations, while the fine adjustment allows dynamic or real-time compensation of temperature-induced variations. The sensitivity correction is accomplished with a programmable system gain configured as a coarse gain adjustment and a fine gain adjustment. The coarse gain adjustment allows compensation of sensor-to-sensor sensitivity variations. The fine gain adjustment allows dynamic or real-time compensation of temperature-induced sensitivity variations. The smart sensor module allows very precise calibration of the sensor, signal processing capabilities, decision making capability and serial interface capability.
A smart sensor module for compensation of sensor-to-sensor and temperature-induced errors in the analog output of a sensor comprising
A signal conditioning circuit for use with a microcontroller as a smart interface for an analog output sensor comprising
A method of compensating for sensor-to-sensor and temperature-induced errors in an analog sensor output using a microcontroller and signal conditioning analog circuitry comprising the steps of
Dependencies are inferred from the claim text.