Cleaning composition and method for removing residues
AssigneeOlin Microelectronic Chemicals, Inc.
InventorsVincent G. Leon, Kenji Honda, Eugene F. Rothgery
Life of this patent
Estimating the term…
Abstract
Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound;(ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.
Claims19
A cleaning composition comprising:
- (i) a hydroxylamine salt compound selected from the group consistiong of hydroxylammonium nitrate, hydroxylammonium phosphate, hydroxylammonium oxalate, hydroxylammonium citrate, and hydroxylammonium chloride;
- (ii) at least one flourine-containing compound;
- and
- (iii) water.
The composition of claims 5 wherein said quaternary ammonium hydroxide compound is selected from the group consisting of:
- tetamethylammonium hydroxide, tetaethylammonium hydroxide, trimethyl hydroxyethylammonium hydroxide, methyl tri (hydroxyethyl) ammonium hydroxide, and tetra(hydroxyethyl)ammonium hydroxide.
A cleaning composition comprising:
- (i) a compound selected from the group consisting of:
- trimethyl hydroxyethylammonium hydroxide, methyl tri (hydroxyethyl) ammonium hydroxide, tetra(hydroxyethyl)ammonium hydroxide, diethylene glycolamine, and N-hydroxyethylpiperazine;
- (ii) at least one fluorine-containing compound;
- and
- (iii) water.
Dependencies are inferred from the claim text.