Processing compositions and methods of using same
AssigneeMicron Technology, Inc.
InventorBrian A. Vaartstra
Life of this patent
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Abstract
Compositions and methods for processing (e.g., cleaning) substrates, such as semiconductor-based substrates, as well as processing equipment, include one or more compounds of Formula (I): ##STR1## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
Claims21
A method of processing a substrate surface, the method comprising:
- providing a substrate surface;
- and
- processing the substrate surface with a processing composition comprising a compound of the formula:
- ##STR4## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
A method of cleaning a substrate surface, the method comprising:
- providing a substrate surface;
- and
- cleaning the substrate surface with a composition comprising a compound of the formula:
- ##STR5## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
A method of processing a semiconductor-based substrate surface, the method comprising:
- planarizing the substrate surface;
- and
- cleaning the planarized substrate surface with a composition comprising a compound of the formula:
- ##STR6## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
A method of cleaning planarization processing equipment, the method comprising:
- providing a planarization surface;
- and
- cleaning the planarization surface with a composition comprising a compound of the formula:
- ##STR7## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
A method of cleaning processing equipment, the method comprising cleaning the processing equipment with a composition comprising a compound of the formula:
- ##STR8## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.
Dependencies are inferred from the claim text.