Minimum error algorithm/program
AssigneeInternational Business Machines Corporation
InventorsJonathan C. Whitcomb, David E. Houser, Pamela Lulkoski
Life of this patent
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Abstract
A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. Each board is x-rayed to determine location coordinates information of the inner layers of multi layer circuit board panels. An optimization process determines optimal locations for drilling. The board is then drilled according to the optimized coordinates. By minimizing misregistration between the drilled holes and inner layers of the multi layer semiconductor circuit board, the present invention reduces a significant cause of scrap to the circuit board industry as well as removing a major impediment to further increasing circuit density and wireability.
Claims30
A method for optimizing the registration of holes to be drilled relative to inner layers of multi-layer circuit board panels comprising:
- 1) collecting location coordinates of inner layers of multi layer circuit board panels;
- 2) calculating errors for combinations of adjustment increments to said location coordinates,
- 3) selecting drilling adjustments from said combinations by iteratively incrementing said adjustment increments in a direction that results in maximum error reduction;
- 4) locating drilling apparatus according to said drilling adjustments;
- 5) drilling a hole in said multi layer circuit board panels according to said drilling adjustments;
- and
- 6) utilizing a grouping process to decide which of said panels should be drilled together.
A computer program device readable by a machine, tangibly embodying a program of instructions executable by a machine to perform method steps for optimizing the registration of holes to be drilled relative to inner layers of multi layer circuit board panels, said method steps comprising:
- 1) collecting location coordinates of inner layers of multi layer circuit board panels;
- 2) calculating errors for combinations of adjustment increments to said location coordinates,
- 3) selecting drilling adjustments from said combinations by iteratively incrementing said adjustment increments in a direction that results in maximum error reduction;
- 4) locating drilling apparatus according to said drilling adjustments;
- 5) drilling a hole in said multi layer circuit board panels according to said drilling adjustments;
- and
- 6) utilizing a grouping process to decide which panels should be drilled together.
Dependencies are inferred from the claim text.