Thermal head
AssigneeSeiko Instruments Inc.
InventorsYoshiaki Saita, Osamu Takizawa
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Abstract
A thermal head comprises a substrate having a main surface bounded by a peripheral edge, an electrode formed on the surface of the substrate, and a heater disposed on the surface of the substrate and electrically connected to the electrode. A driver IC is disposed on the surface of the substrate and is electrically connected to the electrode for providing a drive signal to drive the heater. An encapsulation element is disposed over the IC for protecting the IC. The encapsulation element has a surface portion which extends to the peripheral edge of the substrate.
Claims22
A thermal head comprising:
- a substrate having a peripheral edge;
- a heater formed on the substrate;
- a driver IC mounted on the substrate for providing a drive signal to drive the heater;
- and a sealing element disposed over the IC for protecting the IC, at least a part of the sealing element having a surface portion contiguous with the peripheral edge of the substrate.
A thermal head comprising:
- a substrate having a main surface bounded by a peripheral edge;
- an electrode formed on the main surface of the substrate;
- a heater disposed on the main surface of the substrate and electrically connected to the electrode;
- a driver IC disposed on the main surface of the substrate and electrically connected to the electrode for providing a drive signal to drive the heater;
- and an encapsulation element disposed over the IC for protecting the IC, the encapsulation element having a surface portion extending to the peripheral edge of the substrate.
In combination with a thermal head having a substrate bounded by a peripheral edge and a driver IC disposed on a main surface of the substrate:
- an encapsulation element disposed over the IC for protecting the IC, the encapsulation element having a surface portion contiguous with the peripheral edge of the substrate.
Dependencies are inferred from the claim text.