Semiconductor package with wire bond protective member

A semiconductor package comprising:

• a base configured to retain a semiconductor die comprising a plurality of contacts, the base comprising a surface, a plurality of terminal contacts, and a plurality of first conductors in electrical communication with the terminal contacts;
• an interconnect on the base comprising a plurality of contact members for electrically contacting the contacts on the die, and a plurality of second conductors in electrical communication with the contact members;
• a plurality of wires bonded to the first conductors and to the second conductors;
• a plate on the surface comprising an opening aligned with the interconnect configured to permit access for the die to the interconnect, the plate and the surface configured such that the plate substantially encloses the wires;
• and
• a cover and a force applying member on the base for biasing the die against the interconnect.

A semiconductor package comprising:

• a base configured to retain a semiconductor die comprising a plurality of contacts the base comprising a plurality of terminal contacts configured for electrical communication with testing circuitry and a mounting shelf;
• an interconnect on the base comprising a plurality of contact members configured to make temporary electrical connections with the contacts on the die;
• a plurality of wires bonded to the base and to the interconnect for electrically connecting the terminal contacts to the contact members;
• a protective member on the base comprising a plate on the mounting shelf, the plate and the mounting shelf configured to protect the wires;
• and
• a force arriving member and a cover attached to the base configured to bias the die and the interconnect together.

A semiconductor package comprising:

• a base for retaining a semiconductor die comprising a plurality of contacts, the base comprising a surface and a plurality of first conductors;
• an interconnect on the base comprising a plurality of contact members configured to make temporary electrical connections with the contacts on the die, and a plurality of second conductors in electrical communication with the contact members;
• a plurality of wires bonded to the first conductors and to the second conductors;
• a plate on the surface, the plate and the surface configured such that the plate substantially covers the wires and at least a portion of the interconnect, the slate comprising an opening for allowing access to the interconnect for the die.

A system for testing a semiconductor die having a plurality of contacts comprising:

• a testing apparatus in electrical communication with testing circuitry;
• a base for retaining the die comprising a plurality of terminal contacts configured for electrical communication with the testing circuitry, and a plurality of first conductors in electrical communication with the terminal contacts;
• an interconnect on the base comprising a plurality of contact members configured to electrically engage the contacts on the die, and a plurality of second conductors in electrical communication with the contact members;
• a plurality of wires bonded to the first conductors and to the second conductors;
• a protective member on the base comprising a plate substantially covering the wires and an opening configured to permit placement of the die on the interconnect;
• and
• a force a-olvincr member and a cover attached to the base configured to bias the die against the interconnect.

A method for testing a semiconductor die comprising:

• providing a temporary package for the die;
• providing an interconnect on the package configured to establish temporary electrical communication with the die;
• wire bonding wires to the package and to the interconnect to provide conductive paths therebetween;
• placing a protective member on the base comprising a plate configured to substantially enclose the wires during assembly of the package, the plate comprising an opening aligned with the interconnect configured to permit placement of the die on the interconnect;
• attaching a cover and a force applying member to the base configured to bias the die against the interconnect as the wires are protected by the plate;
• and
• applying test signals to the die.

A method for testing a semiconductor die having a plurality of contacts comprising:

• providing a testing apparatus in electrical communication with testing circuitry;
• providing a temporary package for the die comprising a base comprising a surface and a plurality of terminal contacts electrically connectable to the testing circuitry, and an interconnect on the base comprising a plurality of contact members electrically connectable to the contacts on the die;
• wire bonding wires to the interconnect and to the base to provide conductive paths between the contact members and the terminal contacts;
• placing a plate on the surface with the plate and the surface configured such that the slate substantially encloses the wires;
• attaching a cover and a force applying member to the base configured to bias the die against the interconnect as the wires are protected by the plate;
• and
• applying test signals through the terminal contacts, the wires, and the contact members to the contacts on the die.