US 6,024,275 A · Method of making flip chip and BGA interconnections

Abstract

A method of producing an array of interconnecting contacts for an integrated circuit package, such as a flip chip integrated circuit, and connecting the array of interconnecting contacts to the package utilizes a mold to form the array and attach the array to the package. The method may also be used to interconnect two integrated circuit die. The mold defines a desired shape and relative position for a plurality of interconnecting contacts which make up the array of interconnecting contacts. The array of interconnecting contacts are molded by filling the mold with a desired contact forming material such as solder paste. The mold containing the molded array of interconnecting contacts is positioned adjacent to the integrated circuit package such that each interconnecting contact is positioned adjacent to a corresponding contact pad of the integrated circuit package. And finally, the molded interconnecting contacts are attached to their corresponding contact pads of the integrated circuit package. In the case in which solder paste is utilized as the molding material, the solder is reflowed to attach the array to the package.

Claims15

Dependent claims

A method of producing an array of interconnecting contacts for an integrated circuit package and connecting the array of interconnecting contacts to the package, the method comprising the steps of:

a) providing an integrated circuit package having a plurality of contact pads to which an array of interconnecting contacts is to be attached;
b) providing three molds, the three molds being configured such that, when the molds are stacked adjacent to one another, the molds form an overall mold which defines a desired shape and relative position for a plurality of interconnecting contacts which make up the array of interconnecting contacts;
c) molding the array of interconnecting contacts by filling a first and a third mold with a low temperature contact forming material and filling a second mold with a high temperature contact forming material;
d) positioning the three molds containing the molded array of interconnecting contacts adjacent to the integrated circuit package in order from the first mold to the third mold such that each interconnecting contact is positioned adjacent to a corresponding contact pad of the integrated circuit package;
and
e) attaching the molded interconnecting contacts to their corresponding contact pads of the integrated circuit package.

3 more elements

A method of interconnecting two integrated circuit die, the method comprising the steps of:

a) providing two integrated circuit die, each having a plurality of contact pads to which an array of interconnecting contacts is to be attached;
b) providing three molds, the three molds being configured such that, when the molds are stacked adjacent to one another, the molds form an overall mold which defines a desired shape and relative position for a plurality of interconnecting contacts which make up the array of interconnecting contacts;
c) molding the array of interconnecting contacts by filling a first and a third mold with a low temperature contact forming material and filling a second mold with a high temperature contact forming material;
d) positioning the three molds containing the molded array of interconnecting contacts adjacent to a first one of the two integrated circuit die in order from the first mold to the third mold such that each interconnecting contact is positioned adjacent to a corresponding contact pad of the first integrated circuit die;
e) attaching the molded interconnecting contacts to their corresponding contact pads of the first integrated circuit die;
f) positioning the second integrated circuit adjacent to the array of interconnecting contacts attached to the first integrated circuit die such that each interconnecting contact of the array is positioned adjacent to a corresponding contact pad of the second integrated circuit die;
and
g) attaching the molded interconnecting contacts to their corresponding contact pads of the second integrated circuit die.

5 more elements

Dependencies are inferred from the claim text.

Method of making flip chip and BGA interconnections

Life of this patent

Method of making flip chip and BGA interconnections

Life of this patent

Abstract

Claims15