Ball grid array semiconductor package with solder ball openings in an insulative base

An area grid array package including independent and non-connected circuits formed on a first surface and a second surface of an insulative base material;

• respectively, each circuit on each surface having first pads formed on one end for connection to a semiconductor chip, another end of each circuit having solder ball pads to mount solder balls, each circuit being in electrical connection to a mounted semiconductor chip and the first pads, said circuits and said first pads being molded by an encapsulating resin, each solder ball pad on each surface having a solder ball attached thereto;
• wherein first openings for attaching the solder balls are formed in said insulative base material extending from the second surface and, in which the first openings are filled by a conductive filler to compensate for the thickness of the insulative base material;
• and
• in which the conductive filler is a conductive resin or a plating layer.

A ball grid array semiconductor package comprising:

• an insulative base material;
• circuitry metallizations formed on a first surface and a second surface of the insulative base material the second surface being opposite to the first surface, each circuitry metallization having a first connection pad adjacent one end and a second bonding pad adjacent a second end;
• a semiconductor chip mounted adjacent to said first surface and said first connection pads, said chip being electrically connected to said first connection pads of the circuitry metallizations;
• wherein the insulative base material has first openings extending from the second surface of the insulative base material at a location under second bonding pads;
• wherein each of said first openings confines a portion of a solder ball which is in a solder melt-fixed connection to a facing side of each said second bonding pads, wherein said first openings are in the second surface of the insulative base material and said second openings are either the first or the second surfaces of the insulative base material;
• and
• wherein said second openings are in the first surface and wherein solder balls extend from said chip to connection pads on the first surface and through said second openings to connection pads on said second surface.

An area grid array package including independent and non-connected circuits formed on a first surface and a second surface of an insulative base material;

• respectively, each circuit on each surface having first pads formed on one end for connection to a semiconductor chip, another end of each circuit having solder ball pads to mount solder balls, each circuit being in electrical connection to a mounted semiconductor chip and the first pads, said circuits and said first pads being molded by an encapsulating resin, each solder ball pad on each surface having a solder ball attached thereto;
• wherein the diameter of the solder balls attached to the pads on the first surface of the insulative base material is larger than the diameter of the solder balls to be attached to the pads on the second surface of the insulative base material to compensate for the thickness of the base material;
• and
• wherein a correspondingly large diameter opening is provided in the insulative base material to confine the larger diameter solder balls.