Prepregs of curable epoxy resin compositions with 9,9-Bis (4-aminophenyl) fluorenes as curatives
Assignee3M Innovative Properties Company
InventorsMark D. Weigel, Steven C. Hackett, Timothy J. Clemens
Life of this patent
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Abstract
Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.
Claims16
A prepreg comprising a fiber reinforcement impregnated with a curable epoxy resin composition, said epoxy resin composition comprising:
- (a) at least one aromatic polyepoxide compound having at least two 1,2-epoxide groups;
- and
- (b) at least one 9,9-bis(4-aminophenyl)fluorene amine curative, wherein:
- (i) at least 10% by weight of said fluorene amine curative is heat dissolved in said aromatic polyepoxide, based on the total amount of fluorene amine curative used;
- and
- (ii) at least a portion of said fluorene amine curative is dispersed as a solid therein,
- wherein components (a) and (b)(i) form a homogenous single phase resin having an initial resin glass transition temperature of less than or equal to 15.degree. C. as measured by differential scanning calorimetry at a heating rate of 10.degree. C. per minute.
Dependencies are inferred from the claim text.