Noncontact method of adhering a wafer to a wafer tape
AssigneeTexas Instruments Incorporated
InventorRobert G. McKenna
Life of this patent
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Abstract
A method and apparatus (10) for securing a fragile wafer (14) to a wafer tape (51) secured taut across a wafer frame (50). A controlled jet of gas (46) is directed by a nozzle (45) against the backside of the wafer tape (51) to securely adhere the wafer tape (51) to the backside of the wafer (14). Preferably, a spiral pattern (70) of air is directed by the nozzle (45) to secure the wafer tape (51) to the wafer (14) without forming air bubbles or creases between the wafer tape and wafer. Such a method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are subsequently broken along kerfs and which wafers are inverted to allow particles to drop downwardly.
Claims14
An apparatus for processing a wafer, comprising:
- a) a flexible membrane having an adhesive first surface and an opposing second surface;
- b) a frame supporting said flexible membrane;
- c) support means to support the wafer closely proximate said flexible membrane adhesive first surface;
- and
- d) gas generating means for directing gas against said membrane second surface to increase adhesion of said membrane to said wafer, said gas generating means comprises gas directing means for directing said gas stream from proximate center of said wafer outwardly.
A method of securing a wafer to a flexible adhesive membrane having an adhesive first surface and an opposing second surface, comprising the steps of:
- a) placing a wafer proximate said adhesive first surface;
- and
- b) directing a gas jet against said membrane second surface proximate said wafer to increase adhesion of said membrane adhesive first surface to said wafer, wherein said gas is directed from proximate a center of said wafer outwardly.
Dependencies are inferred from the claim text.