Flexible contact post and post socket and associated methods therefor
AssigneeTessera, Inc.
InventorsThomas H. Distefano, Joseph Fjelstad
Life of this patent
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AssigneeTessera, Inc.
InventorsThomas H. Distefano, Joseph Fjelstad
Estimating the term…
Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced by CTE mismatches between a chip and a substrate during thermal cycling of the chip. The connectors also accommodate deflections in the vertical direction (z direction--perpendicular to the plane of the connectors) which may be caused by connection to a substrate. Such substantially vertical leg features are formed using projection lithography, such as projected x-ray or ultra-violet ("UV") radiation, to selectively expose a photoresist layer such that the substantially vertical metal features may be formed by plating or etching. The sacrificial layer may be in the form of an array of posts, such that "stool-like" post connectors are created, or may be in the form of an array of apertures, such that "basket-like" receptacles or sockets are created. Such a flexible connector may be used in different applications resulting in superior device characteristics, such as: 1) a replacement for flip chip (C4) solder connections or for BGA solder connections; 2) a flexible socket element; or 3) a flexible thermal coupling element.
A flexible connector for interconnecting microelectronic devices, comprising:
A method of manufacturing a flexible connector for microelectronic devices, comprising the steps of:
A method of manufacturing a bump lead socket connector for a microelectronic device, comprising the steps of:
A method of interconnecting microelectronic devices using a flexible connector, said method comprising the steps of providing a connector including a plurality of conductive legs each having a first end and a second end, a top connected to the first end of each leg, a base provided on a first microelectronic device conductively interconnecting the second end of each leg, each leg being substantially vertical with respect to the base and the top, and abutting the connector top to a contact on a second microelectronic device, said connector being deflectable in response to relative dimensional changes between the interconnected microelectronic devices.
Dependencies are inferred from the claim text.