Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims20
A method of sawing a semiconductor substrate, comprising:
- making a first linear cut at least partially through a first portion of said substrate;
- making a second linear cut at least partially through a second portion of said substrate, said second cut being laterally spaced a distance from said first cut;
- and
- making a third linear cut at least partially through a third portion of said substrate, said third cut being spaced differently from said second cut than said second cut is spaced from said first cut.
A method of dicing a semiconductor substrate, comprising:
- substantially severing the semiconductor substrate at a first substantially linear location;
- substantially severing the semiconductor substrate at a second substantially linear location substantially parallel to said first substantially linear location and spaced a first distance apart from said first substantially linear location;
- and
- substantially severing the semiconductor substrate at a third substantially linear location substantially parallel to said first substantially linear location and spaced a different distance from said second substantially linear location than said first distance.
Dependencies are inferred from the claim text.