Apparatus for sealing substrates of field emission device

Abstract

An apparatus for sealing the substrates of a field emission device and a method therefor are provided. The sealing apparatus according to the present invention includes an optical fiber arranged between two substrates near their edges, frit attached to the outer surface of the optical fiber for sealing a space between the two substrates with the optical fiber, a vacuum chamber, a thermal control gauge for controlling the temperature of the substrates during sealing, a plurality of substrate supporting holders having sharp pointed head portions for supporting the substrates on a minimal area, a plurality of heaters spaced from the two substrates by a predetermined distance, a gas injecting hole and a gas exhausting hole provided in one of the two substrates, and an Ar and H.sub.2 gas injector contacting the gas injecting hole.

Dependencies are inferred from the claim text.