Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters

An integrated load beam assembly for supporting a read/write head/slider assembly adjacent to a storage medium and for electrically interconnecting the head to read/write circuitry the load beam assembly comprising:

• a generally planar conductive member extending to proximity of the read/write head/slider assembly;
• a first electrical insulation layer disposed on the conductive member;
• first and second electrical trace paths disposed on the first electrical insulation layer;
• a second electrical insulation layer disposed on the first and second electrical trace paths;
• third and fourth electrical trace paths disposed on the second electrical insulation layer;
• the third and fourth electrical trace paths being laterally offset relative to each other and longitudinally aligned with and overlying respectively the first and second electrical trace paths, and the first electrical trace path being connected in parallel with the fourth electrical trace path and the second electrical trace path being connected in parallel with the third electrical trace path, in order to control at least one of inductance, capacitance and resistance of the integrated load beam assembly.

An integrated load beam assembly for supporting a read/write head/slider assembly adjacent to a storage medium and for electrically interconnecting the head to read/write circuitry, the load beam assembly comprising:

• a generally planar conductive member extending to proximity of the read/write head/slider assembly;
• a first electrical insulation layer disposed on the conductive member;
• first and second electrical trace paths formed on the first electrical insulation layer in a laterally spaced apart relation;
• third and fourth electrical trace paths formed on the second electrical insulation layer in a laterally spaced apart relation;
• a third electrical insulation layer formed on the third and fourth electrical trace paths;
• fifth and sixth electrical trace paths formed on the third electrical insulation layer in a laterally spaced apart relation;
• the first, third and fifth electrical trace paths being longitudinally and laterally aligned relative to each other and connected in parallel, and the second, fourth and sixth electrical trace paths being longitudinally and laterally aligned relative to each other and connected in parallel, in order to control at least one of inductance, capacitance and resistance of the integrated load beam assembly.

An integrated load beam assembly for supporting a read/write head/slider assembly adjacent to a storage medium and for electrically interconnecting the head to read/write circuitry, the load beam assembly comprising:

• a generally planar conductive member extending to proximity of the read/write head/slider assembly;
• a first electrical insulation layer disposed on the conductive member;
• a plurality of first electrical signal ground trace paths disposed on the first electrical insulation layer;
• a second electrical insulation layer disposed on the plurality of electtrical signal ground trace paths;
• a plurality of second electrical signal trace paths disposed on the second electrical insulation layer,
• the second electrical signal trace paths being aligned laterally relative to the first electrical signal ground trace paths in order to control at least one of inductance capacitance and resistance of the integrated load beam,
• a third electrical insulation layer disposed on the second electrical signal trace paths, and
• a plurality of third electrical signal ground trace paths disposed on the third electrical insulation layer, the third electrical signal ground trace paths being aligned laterally relative to the first electrical signal ground trace paths in order to control at least one of inductance, capacitance and resistance of the integrated load beam assembly.

An integrated flexure/conductor structure for supporting a read/write head adjacent to a magnetic disk data storage medium and for electrically interconnecting the head to read/write circuitry of a disk drive, the flexure/conductor structure comprising:

• a first portion including a generally planar conductive flexure member having a gimbal for supporting the read/write head and a second portion comprising a base of non-conductive substrate material;
• a first electrical insulation layer disposed on the flexure member;
• a first series of electrical trace paths disposed on the first electrical insulation layer and on the base;
• a second electrical insulation layer disposed on the first series of electrical trace paths;
• a second series of electrical trace paths disposed on the second electrical insulation layer;
• trace paths of the second series of electrical trace paths being electrically connected in parallel with, and laterally offset relative to, trace paths of the first series of electrical trace paths in at least the second portion in order to control at least one of inductance, capacitance and resistance.

An integrated flexure/conductor structure for supporting a read/write head/slider assembly adjacent to a storage medium and for electrically interconnecting the head to read/write circuitry, the flexure/conductor structure comprising:

• a generally planar conductive flexure member having a gimbal for supporting the read/write head/slider assembly;
• a first electrical insulation layer disposed on the flexure member;
• first and second electrical trace paths disposed on the first electrical insulation layer,
• a second electrical insulation layer disposed on the first and second electrical trace paths,
• third and fourth electrical trace paths disposed on the second electrical insulation layer,
• the third and fourth electrical trace path being laterally offset relative to each other and being longitudinally aligned with and overlying respectively the first and second electrical trace paths,
• the first electrical trace path being connected in parallel with the fourth electrical trace path, and the second electrical trace path being connected in parallel with the third electrical trace path.

An integrated flexure/conductor structure for supporting a read/write head/slider assembly adjacent to a storage medium and for electrically interconnecting the head to read/write circuitry, the flexure/conductor structure comprising:

• a generally planar conductive flexure member having a gimbal for supporting the read/write head/slider assembly;
• a first electrical insulation layer disposed on the flexure member;
• first and second electrical trace paths disposed on the first electrical insulation layer in a laterally spaced apart relation,
• a second electrical insulation layer disposed on the first and second electrical trace path,
• third and fourth electrical trace paths disposed on the second electrical insulation layer in a laterally spaced apart relation,
• a third electrical insulation layer disposed on the third and fourth electrical trace paths,
• fifth and sixth electrical trace paths disposed on the third electrical insulation layer in a laterally spaced apart relation,
• the first, third and fifth electrical trace paths being longitudinally and laterally aligned relative to each other and being connected in parallel,
• the second, fourth and sixth electrical trace paths being longitudinally and laterally aligned relative to each other and being connected in parallel.

A multi-layer conductor trace array for electrically interconnecting a magnetic read/write head to read/write circuitry of a magnetic recording and playback device, the multi-layer conductor trace array comprising:

• a generally planar support member having a longitudinal axis and extending for a substantial distance between the read/write head and the read/write circuitry and including a first electrical insulation layer;
• a first series of electrical trace paths disposed on the first electrical insulation layer on a first side of the longitudinal axis,
• a second electrical insulation layer disposed on the first series of electrical trace paths,
• a second series of electrical trace paths disposed on the second electrical insulation layer on a second side of the longitudinal axis opposite of the first side,
• the second series of electrical trace paths being aligned with the first series of electrical trace path along at least a major part of a longitudinal extent of the support member in order to control at least one of inductance, capacitance and resistance of the multi-layer conductor trace array.