Process for transferring a thin film from an initial substrate onto a final substrate
AssigneeCommissariat a l'Energie Atomique
InventorsBeatrice Biasse, Michel Bruel, Marc Zussy
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Abstract
A thin film is transferred from an initial substrate onto a final substrate. The process includes the following successive stages: joining of the thin film (112) onto a handle substrate (120) comprising a cleavage zone, elimination of the initial substrate, joining of the thin film (112) with a final substrate (132), and cleavage of the handle substrate (120) following the cleavage zone. The cleavage zone includes a film of micro-bubbles formed by ion implantation. The invention has, in particular, applications in the fabrication of three-dimensional structures of integrated circuits.
Claims13
A process for transferring a thin film (112) from an initial substrate (110) onto a final substrate (132) by a handle substrate (120), the thin film having a first face (114) joined to the initial substrate (110) and a second, opposite, free, face (116), comprising the following successive stages:
- joining the thin film by its free face (116) with a superficial film (124) of the handle substrate (120), the superficial film (124) of the handle substrate being joined to a solid part (122) of the handle substrate (120) by the intermediary of a cleavage zone (126), wherein the cleavage zone (126) comprises a film of micro-bubbles;
- eliminating the initial substrate (110);
- joining the first face (114) of the thin film (112) with a face (134) of the final substrate (132);
- and
- cleaving the handle substrate (120) along the cleavage zone (126).
Dependencies are inferred from the claim text.