Method of manufacture of surface acoustic wave device

A method of manufacturing a surface acoustic wave device comprising the steps of:

• forming a comb-electrode on a substrate,
• forming plural electrode pads on said substrate,
• forming an insulation layer surrounding said comb-electrode at an area on said substrate between said comb-electrode and said plural electrode pads,
• forming protecting means which cover said comb-electrode through a space, by substantially covalently bonding said protecting means and said insulation layer in said area between said comb-electrode and said plural electrode pads,
• forming conductive bumps on the tops of each of said plural electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means,
• coating a conductive adhesive layer at least on the tops of said conductive bumps,
• adhering said conductive bumps on an electrode pattern disposed on a package, and
• filling said package with an insulating adhesive to contact said conductive bumps, said conductive adhesive, and said protecting means.

A method of manufacturing a surface acoustic wave device comprising the steps of,

• forming a comb-electrode on a substrate,
• forming plural electrode pads on said substrate,
• forming an insulation layer surrounding said comb-electrode at an area on said substrate between said comb-electrode and said plural electrode pads,
• leveling the surface of said insulation layer,
• forming protecting means which cover said comb-electrode through a space, by substantially covalently bonding said protecting means and said insulation layer in said area between said comb-electrode and said plural electrode pads,
• forming conductive bumps on the tops of each of said plural electrode pads, said conductive bumps consisting of a base bonded to said electrode pad and a protrusion formed on said base, wherein a height of said base is higher than a height of said protection means,
• coating a conductive adhesive layer at least on the tops of said conductive bumps,
• adhering said conductive bumps on an electrode pattern disposed on a package, and
• filling said package with an insulating adhesive to contact said conductive bumps, said conductive adhesive, said protecting means, and said package.