BGA mould assembly for encapsulating BGA substrates of varying thickness

A BGA mould assembly for facilitating an encapsulation of BGA substrates having varying thickness, said assembly having dual in-line cavity bars which clamp BGA substrates during an encapsulation process, said mould assembly comprising:

• a first drive mechanism for controllably applying clamping force to a first cavity bar for clamping a first BGA substrate, a second drive mechanism for controllably applying clamping force to a second cavity bar for clamping a second BGA substrate, said first drive mechanism and second drive mechanism each including,
• a servo motor;
• a linear-conversion means coupled to said servo motor for converting a rotation motion created by said servo motor to a linear movement;
• an input wedge having a top and bottom coupled to said linear-conversion means such that said input wedge moves correspondingly with said linear movement generated by the linear conversion means;
• an output wedge coupled to the first and second cavity bars, said output wedge situated such that a movement by said input wedge causes said output wedge to move in a direction substantially perpendicular to the movement of said input wedge;
• a friction-reducing means disposed on said top and bottom of said input wedge for reducing friction during the movement of said input wedge;
• a supporting frame for said drive mechanisms,
• whereby said first drive mechanism and said second drive mechanism can control said first cavity bar and said second cavity bar independently from each other such that a different clamping force can be applied to said first and second drive mechanisms to account for a different thickness between said first and second BGA substrates.