Back to results
US 5,982,635 AGranted
Signal adaptor board for a pin grid array
AssigneeConcept Manufacturing
InventorsL. William Menzies, Stephen W. Menzies, Dale S. Mackey
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeConcept Manufacturing
InventorsL. William Menzies, Stephen W. Menzies, Dale S. Mackey
Estimating the term…
An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package. The intermediate adaptor board and the socket combine to perform all necessary signal conversion, including power supply voltage levels, between the circuit board and the IC.
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
A system for a converting a first power-supply voltage from a conductor on a printed circuit board to a second power-supply voltage required by an input lead of an integrated circuit package having first and second package surfaces and a plurality of conductive leads extending from the package, the system comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
An interconnect structure for adapting a signal sent between a conductor on a circuit board and at least one of a plurality of leads connected to an integrated circuit package, the package having first and second package surfaces, the interconnect structure comprising:
Dependencies are inferred from the claim text.