Under-pad for chemical-mechanical planarization of semiconductor wafers
AssigneeMicron Technology, Inc.
InventorsScott Meikle, Laurence D. Schultz
Life of this patent
Estimating the term…
Abstract
The present invention is an under-pad placed between a polishing pad and a platen of a planarizing machine used in chemical-mechanical planarization of semiconductor wafers. The under-pad has a body and a plurality of thermal conductors positioned in the body to conduct heat through the body. The body has a top face upon which the polishing pad is positionable and a bottom face engageable with the platen. In operation, heat from the platen and polishing pad flows through the thermal conductors to reduce temperature gradients across the planarizing surface of the polishing pad.
Claims17
A method of planarizing a microelectronic substrate, comprising:
- pressing the microelectronic substrate against a polishing pad in the presence of a planalizing solution, the polishing pad being mounted on an under-pad and the under-pad being attached to a platen;
- moving at least one of the substrate and the platen with respect to the other to impart relative motion between the substrate and the polishing pad;
- and
- transferring heat between the polishing pad and the platen through a thermally conductive material in the under-pad, the thermally conductive material being separate from a continuous phase matrix material of the under-pad.
A method for planarizing a microelectronic-device substrate assembly on a planarizing surface of a polishing pad mounted to an under-pad on a support member, comprising:
- removing material from a surface of the substrate assembly by pressing the substrate assembly against the planarizing surface and imparting motion between the substrate assembly and the polishing pad;
- and
- maintaining a desired temperature at the interface between the planarizing surface and the substrate assembly by passing thermal energy between the support member and the polishing pad through a plurality of thermal conductors in the under-pad, the thermal conductors being a component of the under-pad separate from a matrix material of the under-pad.
A method for planarizing a microelectronic-device substrate assembly on a planarizing surface of a polishing pad mounted to an under-pad on a support member, comprising:
- removing material from a surface of the substrate assembly by pressing the substrate assembly against the planarizing surface and imparting motion between the substrate assembly and the polishing pad;
- and
- cooling the interface between the planarizing surface and the substrate assembly by reducing the temperature of the support member and dissipating heat from the polishing pad to the support member through a plurality of thermal conductors in the under-pad, the thermal conductors being a component of the under-pad separate from a matrix material of the under-pad.
A method for planarizing a microelectronic-device substrate assembly on a planarizing surface of a polishing pad mounted to an under-pad on a support member, comprising:
- removing material from a surface of the substrate assembly by pressing the substrate assembly against the planarizing surface and imparting motion between the substrate assembly and the polishing pad;
- and
- heating the interface between the planarizing surface and the substrate assembly by increasing the temperature of the support member and delivering heat to the polishing pad from the support member through a plurality of thermal conductors in the under-pad, the thermal conductors being a component of the under-pad separate from a matrix material of the under-pad.
A method for planarizing a microelectronic-device substrate assembly on a planarizing surface of a polishing pad mounted to an under-pad on a support member, comprising:
- removing material from a surface of the substrate assembly by pressing the substrate assembly against the planarizing surface and imparting motion between the substrate assembly and the polishing pad;
- and
- controlling the temperature at the interface between the planarizing surface and the substrate assembly by passing thermal energy between the support member and the polishing pad through a plurality of carbon fiber strands in the under-pad, the carbon fiber strands extending from an upper surface to a lower surface of the under-pad.
A method for planarizing a microelectronic-device substrate assembly on a planarizing surface of a polishing pad mounted to an under-pad on a support member, comprising:
- removing material from a surface of the substrate assembly by pressing the substrate assembly against the planarizing surface and imparting motion between the substrate assembly and the polishing pad;
- and
- controlling the temperature at the interface between the planarizing surface and the substrate assembly by passing thermal energy between the support member and the polishing pad through a plurality of carbon fiber filaments in the under-pad.
Dependencies are inferred from the claim text.