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US 5,979,578 AGranted
Multi-layer, multi-grade multiple cutting surface PDC cutter
AssigneeSmith International, Inc.
InventorScott M. Packer
Life of this patent
Estimating the term…
Abstract
An improved polycrystalline diamond composite ("PDC") cutter with secondary PDC cutting surfaces in addition to a primary PDC cutting surface is formed comprising of at least two wafers of cemented carbide bonded together. The secondary cutting surfaces are formed by compacting and sintering diamond in grooves formed at the surface of the wafers. Wafers of different grades of cemented carbide may be used. Moreover, different grades of diamond may be compacted and sintered in different grooves.
Claims28
A PDC cutter comprising:
- a body comprising at least two grades of cemented carbide and an end face;
- a polycrystalline diamond layer on the end face of the body;
- and
- a plurality of grooves formed in the body wherein the plurality of grooves are packed with polycrystalline diamond, wherein the grade of diamond in a first groove is different from the grade of diamond in a second groove.
1 more element
A PDC cutter comprising:
- a first cylindrical wafer having a cylindrical outer surface;
- a second cylindrical wafer having a cylindrical outer surface;
- a groove formed on the cylindrical outer surface of one of the the carbide wafers, the groove spanning the entire length of said one carbide wafer, wherein the first wafer is coaxially bonded to the second wafer forming a cylindrical cutter body having a groove on its outer surface;
- a polycrvstalline diamond composite layer on an end face of the cutter body;
- and
- polycrystalline diamond in the groove.
3 more elements
A PDC cutter comprising:
- a cylindrical body comprising at least two coaxial cylindrical carbide wafers bonded together wherein each wafer has a length;
- a polycrystalline diamond composite layer on an end face of a first wafer of cemented carbide;
- a plurality of grooves formed in one of the wafers, the grooves packed with polycrystalline diamond, wherein the grade of diamond in a first groove is different from the grade of diamond in a second groove.
A cutter comprising:
- a cemented carbide body comprising an end face;
- a layer of ultra hard material on the end face of the body;
- and
- two grooves formed in the body wherein each of the grooves is packed with an ultra hard material, wherein the grade of ultra hard material in a first groove is different from the grade of ultra hard material in a second groove.
1 more element
A cutter comprising:
- a cylindrical body comprising at least two coaxial cylindrical carbide wafers bonded together wherein each wafer has a length;
- a layer of ultra hard material layer on an end face of a first wafer of cemented carbide;
- a first groove formed on in one of the wafers;
- a second groove formed in the other wafer;
- a first grade of ultra hard material filling the first groove;
- and
- a second grade of ultra hard material filling the second groove, wherein the first grade of ultra hard material is different from the second grade of ultra hard material.
4 more elements
Dependencies are inferred from the claim text.