Electronics board assembly apparatus comprising an indexed punch

An indexing arrangement comprising:

• a base;
• a slide which is mounted to the base for movement along the base;
• a bracket;
• a roller member which is rotatably mounted to the bracket;
• and
• at least a first engagement component having a first engagement surface, wherein movement of the slide into a first position causes the roller member to come to rest in the engagement surface, the engagement surface having first and second portions on opposing sides of the roller member when at rest in the engagement surface, the first and second portions having heights transverse to the direction of movement of the slide along the base so that both the first and second portions, while still allowing for movement of the roller member over them, provide resistance against the roller member leaving the engagement surface, the height of the first engagement surface being lower than the height of the second engagement surface so that the first portion provides less resistance than the second portion against the roller member leaving the engagement surface.

A method of assembling an electronics board, comprising the steps of:

• placing a substrate on a slide;
• placing a component on the substrate;
• moving the slide into a first position so that a roller member comes to rest in an engagement surface of an engagement member, the engagement surface having first and second portions on opposing sides of the roller member when snapped into the engagement surface, wherein the first and second portions have heights transverse to the direction of movement of the slide and the height of the first portion is lower than the height of the second portion so that the first portion provides less resistance than the second portion against the ball member leaving the engagement surface;
• and
• punching the component into the substrate.