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AssigneeMatsushita Electronics Corporation
InventorsYukio Yamaguchi, Akira Oga, Toru Nomura, Masanori Minamio
Estimating the term…
In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom, the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.
A lead frame for use in manufacturing a semiconductor device including a semiconductor chip, comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.