Apparatus for and method of cleaning substrate

An apparatus for cleaning a substrate, comprising:

• a) an ultrasonic cleaner injecting a liquid that has been subjected to an ultrasonic wave toward said substrate so as to perform ultrasonic rinsing on said substrate;
• and
• b) a high-pressure cleaner disposed at a different position from said ultrasonic cleaner, said high-pressure cleaner having a high-pressure cleaning nozzle which jets out high-pressure liquid toward said substrate at a pressure of higher than about 5 kg/cm.sup.2 so as to perform high-pressure rinsing on said substrate, whereby combined rinsing is performed on the substrate by combining said ultrasonic rinsing and said high-pressure rinsing.

An apparatus for cleaning a substrate, comprising:

• a) an ultrasonic cleaner injecting a liquid that has been subject to an ultrasonic wave toward said substrate so as to perform ultrasonic rinsing on said substrate, said ultrasonic cleaner including an ultrasonic rinsing nozzle for injecting said liquid, which has been subject to said ultrasonic wave, through a split towards an ultrasonic rinsing line defined on a surface-to-be-cleaned of said substrate;
• and
• b) a high-pressure cleaner disposed at a different position from said ultrasonic cleaner, said high-pressure cleaner jetting out high-pressure liquid toward said substrate so as to perform high-pressure rinsing on said substrate, said high-pressure cleaner including an high-pressure rinsing nozzle for jetting out high-pressure liquid toward a high-pressure rinsing spot defined on said surface-to-be-cleaned of said substrate whereby combined rinsing is performed on the substrate by combining said ultrasonic rinsing and said high-pressure rinsing.

An apparatus for cleaning a substrate, comprising:

• a) ultrasonic cleaning means for emitting an ultrasonic wave onto a liquid while injecting said liquid toward said substrate so as to perform ultrasonic rinsing on said substrate, said ultrasonic cleaning means including an ultrasonic rinsing nozzle for injecting said liquid, which is subjected to said ultrasonic wave, through a slit towards an ultrasonic rinsing line defined on a surface-to-be-cleaned of said substrate;
• and
• b) high-pressure cleaning means disposed at a different position from said ultrasonic cleaning means, said high-pressure cleaning means jetting out high-pressure liquid toward said substrate so as to perform high-pressure rinsing on said substrate, said high-pressure cleaning means including a high-pressure rinsing nozzle for jetting out high-pressure liquid towards a high-pressure rinsing spot defined on said surface-to-be-cleaned of said substrate whereby combined rinsing is performed on said substrate by combining said ultrasonic rinsing and said high-pressure rinsing.