Stacked carrier three-dimensional memory module and semiconductor device using the same

A three-dimensional memory module comprising:

• a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and
• wherein each of said plurality of semiconductor device units other than a specific one comprises:
• a carrier having a first circuit pattern and said through-holes of said each semiconductor device unit connected to said first circuit pattern;
• and
• at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said first circuit pattern, and
• wherein said specific semiconductor device unit comprises:
• a carrier having a second circuit pattern and said through-holes of said specific semiconductor device unit connected to said second circuit pattern;
• and
• at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.

A semiconductor device, comprising:

• a circuit board having a first circuit pattern;
• and
• a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern, and
• wherein each of said plurality of three-dimensional memory module comprises:
• a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bumps, and
• wherein each of said plurality of semiconductor device units comprises:
• a carrier having a second circuit pattern and said through-holes connected to said second circuit pattern;
• at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said second circuit pattern;
• and
• at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip.

A semiconductor device comprising:

• a circuit board having a first circuit pattern;
• and
• a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern,
• wherein each of said plurality of three-dimensional memory module comprises:
• a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and
• wherein each of said plurality of semiconductor device units other than a specific one comprises:
• a carrier having a second circuit pattern and associated through-holes connected to said second circuit pattern;
• and
• at least one semiconductor memory chip being mounted on said carrier such that said one semiconductor memory chip is connected to said second circuit pattern, and
• wherein said specific semiconductor device unit comprises:
• a carrier having a third circuit pattern and associated through-holes connected to said third circuit pattern;
• and
• a chip select semiconductor chip mounted on said carrier connected to said third circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.