Method of manufacturing a planar coil using a transparency substrate
AssigneeIndustrial Technology Research Institute
InventorsMin-Chieh Chou, Ching-Yi Wu, Star Rey-Shing Huang, Yuh-Sheng Lin
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Abstract
The present invention uses a glass to act as a substrate. A stencil layer is patterned on the top surface of the substrate. Successively, a copper layer is deposited over the substrate. Next step is to remove the stencil layer. A negative photoresist layer is formed on the copper layer. A negative photoresist layer is processed using a backside exposure of the resist through the transparent substrate. The backside exposure technique uses the self-aligning, conductive copper layer as a mask. A plurality of trenches are then created in the photoresist layer and a second copper layer is electroplated in the trenches to form the planar coils.
Claims15
A method for manufacturing a planar coil on a transparency substrate for a micromachine, said transparency substrate having a first surface and a second surface, said method comprising the steps of:
- forming a stencil layer on said first surface of said transparency substrate;
- patterning said stencil layer using lithography;
- forming a first conductive layer on said stencil layer and on said first surface of said transparency substrate to serve as said planar coils;
- removing said first stencil layer, portions of said first conductive layer remaining on said first surface of said transparency substrate;
- forming a photosensitive layer on said first conductive layer and on said first surface of said transparency substrate;
- exposing said photosensitive layer from said second surface of said transparency substrate;
- developing said photosensitive layer, said exposed portions of said photosensitive layer remaining on said first surface of said transparency substrate, thereby forming trenches between said exposed portions of said photosensitive layer, said first conductive layer being in said trenches;
- and
- forming a second conductive layer in said trenches and on said first conductive layer to serve as said planar coils.
Dependencies are inferred from the claim text.