Heating system for high throughput sputtering
AssigneeSeagate Technology LLC
InventorsDennis R. Hollars, Delbert F. Waltrip, Robert B. Zubeck, Josef Bonigut, Robert M. Smith, Gary L. Payne
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AssigneeSeagate Technology LLC
InventorsDennis R. Hollars, Delbert F. Waltrip, Robert B. Zubeck, Josef Bonigut, Robert M. Smith, Gary L. Payne
Estimating the term…
A high throughput sputtering apparatus which provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus comprises a plurality of buffer and sputtering chambers which include an input end and an output end. The substrates are transported through the chambers at varying rates of speed such that the rate of speed of a pallet from the input end to the output end is a constant for each of the pallets. The high throughput sputtering apparatus also includes a transport system which transports the substrates through the sputtering chambers at variable velocities, a high capacity vacuum pump system which evacuates the ambient pressure within the sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation, a substrate heating system which heats the substrates to a temperature conducive to sputtering the coatings thereon and provides a substantially uniform temperature profile over the surface of the substrates; and an electronic control system which provides control signals to and for receiving feedback input from other components of the apparatus. The electronic control system is programmable to control the sputtering chambers, the transport system, the vacuum pump system, and the substrate heating system. The substrate heating system efficiently maintains a desired substrate temperature by minimizing radiative heat losses as the substrates proceed through the sputtering apparatus. The high throughput sputtering apparatus provides substrates to be sputtered in a rapid and uniform heating process to optimize film integrity during the sputtering steps, provides successive layers of thin films on the substrates, and removes the sputtered substrates without contaminating the environment.
A high throughput sputtering apparatus having a plurality of integrally matched components, said components comprising:
A substrate heating system for rapidly and uniformly heating substrates in a high throughput sputtering system for providing magnetic recording media, comprising:
A substrate heating system for rapidly and uniformly heating substrates in a high throughput sputtering system for providing magnetic recording media, comprising:
A substrate heating system for rapidly and uniformly heating substrates being transported along a substrate transport path in a high throughput sputtering system for providing magnetic recording media, comprising:
A substrate heating system for rapidly and uniformly heating substrates secured to a pallet traveling along a substrate transport path in a high throughput sputtering system for providing magnetic recording media, comprising:
A substrate heating system for rapidly and uniformly heating substrates secured to a pallet traveling along a substrate transport path in a high throughput sputtering system for providing magnetic recording media, comprising:
A substrate heating system for rapidly and uniformly heating substrates to a temperature conducive to sputtering in a high throughput sputtering system for providing magnetic recording media, comprising:
Dependencies are inferred from the claim text.