Method of fabricating multilayer structures with nonplanar surfaces

A method of fabricating a multilayer structure from a stack of layers formed from ceramic material, said stack of layers does not contain adhesive between each layer and forms a recess defined by layers suitable for providing a semiconductor chip therein, said recess having a depth and an area, said method including the steps of:

• (a) providing a block of resilient, compliant material on or over one or more stacks of layers including said area over the recess, said block of resilient, compliant material having a thickness greater than said depth of said recess;
• (b) applying sufficient pressure to said one or more stacks of layers to cause said resilient, compliant material to deform and fill said recess and cause interlayer adhesion of said layers;
• (c) lifting said resilient, compliant material off said one or more stack of layers subsequent to the application of pressure;
• (d) providing a second set of one or more stacks of layers that have not been subjected to step (b);
• and
• (e) repeating steps (a) through (d) with said second set of one or more stacks of layers and said block of resilient, compliant material.

A method of making a multilayer ceramic substrate comprising the steps of:

• (a) forming green tape;
• (b) cutting said green tape into sheets;
• (c) forming via holes in said sheets;
• (d) forming patterns of electrically conductive paste on said sheets and stacking said sheets to form stacks of sheets having an area with a recess and an area without a recess, said stacks of sheets does not contain adhesive between each layer, said recess having a depth;
• (e) providing a block of resilient, compliant material on or over said stacks of sheets including said area with a recess, said block of resilient, compliant material having a thickness greater than the depth of said recess;
• (f) applying sufficient pressure to said stacks of sheets to cause said resilient, compliant material to deform and fill said recess and cause interlayer adhesion of said stacks of sheets;
• (g) lifting said resilient, compliant material off said stacks of sheets subsequent to the application of pressure;
• (h) firing said stacks of sheets.